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LIGHT-CURABLE ADHESIVES FOR ELECTRONICS ASSEMBLY

Incure offers a wide range of UV light-curable adhesives for electronics assembly. These UV light curing adhesives cure in seconds upon exposure to ultraviolet light are suitable for LCD, OLED connector reinforcement, C-MOS connector, electronic component etc.

LIGHT CURABLE ADHESIVES FOR ELECTRONICS ASSEMBLY
UV light curing adhesives
ADHESIVES FOR ELECTRONICS ASSEMBLY

Advantages of Incure Electronic Materials

Cure In Seconds
Solvent Free
One Component, No Mixing

Learn about our Light Curing Systems: 

C9000 / U8000 UV Light Curing Conveyor Systems
L9000 Compact UV LED Spot Curing Lamp
S10 / S20 Ultra High Intensity Light-Curing Spot Lamp

    Overview of Product Spectrum (Metal Bonder)
    Product Description   Color Viscosity Tensile Hardness Elongation
             cP psi shore %
    1283

Cures with UV / Visible /  Heat or Actif 398. Good clarity, heat and moisture resistance. Good passive vibration isolation capability. Ideal for relays for circuit breakers in the electronics industry for outdoor use.

  

Clear

 400 - 800 5,700 - 9,800 D68 - D78 55
    1203

Cures tack-free with up to 5,400 PSI on many different metals / glass /  ceramics. Very low linear shrinkage with enhanced excellent moisture and temperature resistance. Good passive vibration isolation capability.

  

Clear

 500 - 900 4,400 - 5,400 D59 - D69 400
    Overview of Product Spectrum (Plastic Bonder)
    Product Description   Color Viscosity Tensile Hardness Elongation
             cP psi shore %
    1462

Low viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application.

   Slightly Amber 300 - 600 2,800 - 6,900 D49 - D59 827
    1483

Medium viscosity, acid-free, multi-substrate /  plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application.

  

Slightly Translucent 

 

 		  700 - 1,600 2,800 - 7,000 D55 - D65  915
    1063

Medium viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application.

  

Clear

 1,800 - 3,200 3,300 - 7,000 D58 - D68 380
    Overview of Product Spectrum (Potting)
    Product Description   Color Viscosity Tensile Hardness Elongation
             cP psi shore %
    3339

Very thick, low water absorption electronics sealant. Provides air-tight seal with ease of peel for rework. Tough yet elongating. Widely use for automotive and electronics industries for its low CTE properties.

  

Slight Translucent

 27,000 - 50,000 1,100 - 3,400 A12 - A22 71
    6228HT

Cost efficient epoxy-acrylate, thick viscosity, ultra-low shrinkage and water absorption potting compound for use in sensitive electronic devices. UV / Heat curable. Chemical and vapor resistance.

   Clear 5,000 - 8,000 1,700 - 5,600 D55 - D65 160
    6213

Cost efficient epoxy-acrylate low viscosity, ultra-low shrinkage and water absorption potting material for use in sensitive electronic devices. Chemical and vapor resistance.

    Transparent 500 - 1,200  2,200 - 2,700  D55 - D65   210
   Package Size: 10 ml syringe / 30 ml syringe / 1 kg Bottle