UV Light Curable Encapsulants  
  for Microelectronic Assembly and IC Protection  
                 
 

 

NEW!  Hybrid CoatTM EL-9088
A Truely UV Curable Black Encapsulant

 

EL-9088 UV Black, Micro-Electronics Encapsulant is a hybrid opaque UV/heat curable adhesive that bonds to various substrates. Designed for use for as a dam and fill material, this product can be effectively cured in less than 3 minutes up to a thickness of 1.25mm. EL-9088 is also commonly used as a potting material of more than 2.5mm in depth and can be effectively cured in 30 mins at 110°C. Formulated to withstand thermal cycles of -40°C to 150°C with improved moisture and thermal resistance.

Hybrid CoatTM Series of UV Encapsulants offers manufacturers many benefits including faster production speed and capacity, less floor space (eg. special storage conditions), reduction of Work-In-Process, increasing yields and reducing scrap to name a few.

 

 
  Advantages of Incure's EL-9088      
  One Component - No Mixing        
  Solvent Free        
  Low Odor             
  Ease of application, "Ready-To-Use" Product      
    Room Temperature Storage      
  Shelf Life (6 months)      

 

  Chip-on-Board (COB) Encapsulants and Wire Bonders
 
    Overview of Product Spectrum  
    Product Description
Color Viscosity Shore Elongation    
            cps Hardness %    
    EL-9047 Flexible, High Adhesion, High Moisture Resistance, Bonds to Wide Variety Substrates
Clear 4,000 - 5,000 A85 300    
    EL-9050

Ultra Fast Cure, Low Modulus for Wire Bonding, Secondary Heat Cure for Shadowed Areas

Clear 4,000 - 5,000 D45 150    
    EL-9054

Ultra Fast Cure, Low Modulus for Wire Bonding, Secondary Heat Cure for Shadowed Areas

Clear
15,000 - 17,000 D45 150    
    EL-9062

Moisture and Thermal Resistant, Secondary Heat Cure for Shadowed Areas, Flexible

Clear 15,000 - 17,000 D40 35