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  Silicone Potting and Encapsulating    
  Adhesives for Electronics              
                       
  Incure Silicone Potting and Encapsulating Adhesive is the ideal choice for protecting sensitive electronic components from extreme environments. These potting materials and encapsulants can withstand temperatures from -45°C to 250°C while protecting the components from vibration, moisture, and atmospheric contaminents. Consists of both tin and platinum curing systems in a variety of durometers and cure speeds.  
                       
  Wide Operating Temperatures          
  Flexible              
  UV Resistance              
  Resistant to Humidity and Water              
                       
    Overview of Product Spectrum  
    Product Chemistry Color Work Time Cure Time Viscosity Temp. Resistance Elongation Tensile  
          RT, min Tack Free cps °C % psi  
    CC-608 Oxime Clear 10 20 min TF 100 -45 to 250 N.A. N.A.  
    CC-621 Oxime Light Blue 60 24 hrs. RT 3600 -45 to 250 200 350  
    CC-622 Platinum Clear >120 10 min 150°C 1000 -45 to 250 N.A. N.A.  
    CC-623 Platinum Clear 120 10 min 150°C 1000 -45 to 250 N.A. N.A.  
    CC-624 Platinum Clear 120 10 min 150°C 1000 -45 to 250 N.A. N.A.  
    CC-625 Bi-Cure Clear 15 sec. uv 24 hrs. RT 400 – 800 -45 to 250 N.A. 100  
    CC-626 Platinum Light Blue 30 60 min RT 1000 -45 to 250 >200 50  
    CC-627 Platinum Clear 120 10 min 150°C 1000 -45 to 250 200 50  
    Package Size: 10.3 oz.cartridge / 40 lb.              
                   
   

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