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  One Part Epoxy  
  www.uv-incure.com    
                     
  Incure offers a wide range of one part epoxy for bonding a variety of materials such as ceramic, plastic and metal.
These one-part high performance epoxies exhibit fast cure, toughness, moisture resistance and harsh environments.
 
                     
    Overview of Product Spectrum  
    Product Application   Color Viscosity Shore Hardness Tg Pot Life  
            cps   °C days  
    5106 5106 is a one component epoxy adhesive suited where low curing temperatures are required for heat sensitive components. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. 5106 is excellent for plastics bonding.   Black 8000 – 13000 D67 26 7  
    5115 5115 is a one component epoxy adhesive for electronic devices bonding. Ideal for general purpose industrial utilities requiring extended work life. This epoxy resin exhibits good adhesion strength, high hardness, greasy resistance, chemical and solvent resistance. Fast cure at low temperature and is suited for different kinds materials bonding. The durability of this product is very high levels and this resin can pass many environmental experiments. This product is well suited for heat sensitive components bonding, Memory cards and C-MOS assembling.   Black 30000 – 50000 D78 30 7  
    5116 5116 is a one part epoxy adhesive for industrial materials. This resin has excellent adhesion strength and impact strength. The crack and fatigue resistance of this product are outstanding in many vibrational applications. 5116 offers good chemical resistance and is well suited for structual parts bonding. This product is also suited for metals and other kinds of materials bonding, such as ceramics, glass and plastics. This product is recommanded as a high performance adhesive with both Tg and adhesion strength.   Grey 130000 – 230000 D85 125 7  
    5123 5123 is a one component epoxy that is designed for high temperature curing. This resin exhibits excellent adhesion and impact strength. The crack and fatigue resistance of this product are outstanding in many vibrational applications. 5123 is suited for structural devices, ceramics and plastics bonding.   Grey 70000 – 120000 D85 99 7  
    5126 5126 is a one component epoxy adhesive for the application of electronic devices. This resin develops tough, strong, structural bonds which provide excellent shear, peel and impact strength. The durability of this product is very high levels and this resin can pass many environmental test experiments. This product can be also suited for electronic devices encapsulation. Cured resin is glossy.   Black 80000 D89 128 7  
    5127 5127 is a one-part epoxy for sealing. Cured product exhibits low shrinkage and good machinability. This resin is able to reduce the working time and increase the efficiency at the same time. This product is suited for plastics sealing. It can fuidify quickly when using. It is not easy to permeate the gap when curing. The durability of this product is very high levels and this resin can pass many environmental test experiments.   Black 25000 – 60000 D89 140 1 to 2  
    5133 5133 is an epoxy adhesive for industrial materials. This resin has excellent adhesion strength and impact strength. The crack and fatigue resistance of this product are outstanding in many vibrational applications. 5133 has good chemical resistance and is well suited for structual parts bonding. Also suited for metals and other kinds of materials bonding, such as ceramics, glass and plastics. This product is recommanded as a high performance adhesive with both Tg and adhesion strength.   Grey 140000 – 220000 D85 125 7  
    5134 5134 is a one component epoxy adhesive for electronic devices. This product can develop tough, strong, structural bonds. 5134 offers fast curing, low thermal conductivity and shrinkage. It has excellent heat resistance. This product exhibits good flame-retardant properties and excellent durability. This resin is easy to operate and suited for all kinds of electronic devices encapsulation.   White 220000 D90 100 3  
    5136 5136 is a one component epoxy adhesive for the application of rework and electronic devices. This product is easy to operate and suited for various applications of electronic components, such as casting and sealing. This resin can be fast cured at high temperature, is able to reduce the working time and increase the efficiency at the same time. 5136 develops tough, strong, structural bonds which provide excellent shear, peel and impact strength. The durability of this resin is very high levels and this resin can pass many environmental test experiments.   Black 3000 D80 50 2  
    5137 5137 is a one component epoxy adhesive for the electronic devices. This product is easy to operate and suited for various applications of electronic components, such as casting and sealing. This resin can be fast cured at high temperature, is able to reduce the working time and increase the efficiency at the same time. This product develops tough, strong, structural bonds which provide excellent shear, peel and impact strength. The durability of this resin is very high levels and this resin can pass many environmental test experiments.   Black 300 D85 85 3 – 5  
    5138 5138 is a one part epoxy adhesive for the application of rework and electronic devices. This resin has good operation properties and is suited for electronic devices coating, sealing and encapsulation. Recommended as a general adhesive where convenience and speed at high temperature is desired. 5138 is able to reduce the working time and increase the efficiency at the same time. This resin develop tough, strong, structural bonds which provide excellent shear, peel and impact strength. The durability of this product is very high levels and this resin can pass many environmental test experiments.   Black 1500 – 1900 D87 95 7  
    5139 5139 is a one-part high viscosity and thixotropic epoxy. The reactivity of this product is good at the temperature higher than 100C. This product is suitable for screen printing and dispensing. Exhibits good strong curing shapes without stringing and slumping at super high speed dispensing and very small dots. The cured product exhibits good adhesive strength, electrical insulation properties, excellent chemical resistance and solvent resistance. Stable adhesive strength can be obtained with a variety of SMT.   Red 36000 – 54000 D85 89 5 to 7  
    5140 5140 is a one component epoxy adhesive for the application of rework and electronic devices. This product is easy to operate and suited for various applications of electronic components, such as casting and sealing. Offers fast cure at high temperature, is able to reduce the working time and increase the efficiency at the same time. 5140 develops tough, strong, structural bonds which provide excellent shear, peel and impact strength. The durability of this resin is very high levels and this resin can pass many environmental test experiments. Well suited for flip-chip underfill packaging process, and it can quickly fill the gap between the wafer complete package.   Black 10000 D90 125 3 to 5  
    5141 5141 is a one component epoxy adhesive for the application of rework and electronic devices. This product is easy to operate and suited for various applications of electronic components, such as casting and sealing. This resin can be fast cured at high temperature, is able to reduce the working time and increase the efficiency at the same time. 5141 develops tough, strong, structural bonds which provide excellent shear, peel and impact strength. The durability of this resin is very high levels and this resin can pass many environmental test experiments.   Light Grey 52000 - 28 5 to 7  
    Package Size: 10ml / 30ml syringe